DLC (diamond-like carbon) coating technology is a professional technology applied in the field of punching tools. The industrial production of DLC coating began at the end of the 20th century. It is a new coating technology compared with hard coatings (such as TiN, TiAlN, CrN, TiCN, etc.) applied to molds. In the process of semiconductor packaging, pin cutting and forming, high-precision mold is the key to ensure product quality. The surface quality of the mould also determines the excellent rate, production efficiency and electrical performance of the product. Therefore, the mold used in semiconductor packaging industry not only requires high precision, but also requires mold edge parts to develop towards the direction of low friction coefficient and high hardness. The coating using plasma DLC coating technology is the main solution to this problem.
Rationale:
DLC coating treatment uses a physical vapor deposition (PVD) technology. Under vacuum conditions (1.3x10-2 ~ 1.3x10-4Pa), the low voltage and high current arc discharge technology is used to vaporize the target and ionize the vaporized substance and gas by gas discharge, and the vaporized substance and its reaction products are deposited on the workpiece by the acceleration of electric field.
DLC coating is a kind of coating containing diamond in microstructure. The main element of DLC is carbon. Different combinations of carbon atoms produce different substances: diamond - carbon is combined in the form of sp3 bond; Graphite carbon is bonded in the form of sp2 bond. Diamond like carbon (DLC) is bonded in the form of sp3 and sp2 bonds; The coating structure is an amorphous structure (no dominant lattice structure) formed by mixing sp3 and sp2 forms of carbon. The performance of the coating depends on the percentage of sp3 and sp2 in the formed film structure. The higher the percentage of sp3, the closer the film performance is to natural diamond, and the higher the microhardness; The higher the proportion of sp2, the better the self-lubricating performance of the film, the smaller the friction coefficient, but the lower the microhardness (the friction coefficient between it and the metal is generally 0.05~0.2). By setting the process parameters in the production process and selecting different targets, the properties of the formed film can be controlled to meet the needs of different occasions.
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